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A1120, A1121, and A1125
Chopper Stabilized Precision Hall Effect Switches
Features and Benefits
Unipolar switchpoints Resistant to physical stress Superior temperature stability Output short-circuit protection Operation from unregulated supply Reverse battery protection Solid-state reliability Small package sizes
Description
The A1120, A1121, and A1125 Hall-effect, unipolar switches are extremely temperature-stable and stress-resistant sensor ICs, especially suited for operation over extended temperature ranges to 150C. Superior high-temperature performance is made possible through dynamic offset cancellation, which reduces the residual offset voltage normally caused by device overmolding, temperature dependencies, and thermal stress. Each device includes on a single silicon chip a voltage regulator, Hall-voltage generator, small-signal amplifier, chopper stabilization, Schmitt trigger, and a short-circuit protected open-drain output to sink up to 25 mA. An on-board regulator permits operation with supply voltages of 3 to 24 V. The advantage of operating down to 3 V is that the device can be used in 3 V applications or with additional external resistance in series with the supply pin for greater protection against high voltage transient events. For the A1120 and A1121, a south pole of sufficient strength turns the output on. Removal of the magnetic field turns the output off. The A1125 is complementary, in that for these devices, a south pole turns the A1125 output off, and removal of the magnetic field turns the output on.
3-pin SIP (suffix UA)
Packages:
3-pin SOT23W (suffix LH)
Not to scale
Two package styles provide a magnetically optimized package for most applications. Package type LH is a modified SOT23W, surface mount package, while UA is a three-lead ultra-mini SIP for through-hole mounting. Each package type is lead (Pb) free (suffix, -T), with a 100% matte tin plated leadframe.
Functional Block Diagram
VCC
Regulator To All Subcircuits
Amp
Sample and Hold
Dynamic Offset Cancellation
Low-Pass Filter
VOUT
Control
Current Limit
GND
A1120-DS, Rev. 11
A1120, A1121 and A1125
Chopper Stabilized Precision Hall Effect Switches
Selection Guide
Part Number A1120ELHLX-T A1120ELHLT-T2 A1120EUA-T A1120LLHLX-T A1120LLHLT-T2 A1120LUA-T A1121ELHLX-T A1121ELHLT-T2 A1121EUA-T A1121LLHLX-T A1121LLHLT-T2 A1121LUA-T A1125ELHLX-T A1125EUA-T A1125LLHLX-T A1125LUA-T
*Contact Allegro
Packing1 13-in. reel, 10000 pieces/reel 7-in. reel, 3000 pieces/reel Bulk, 500 pieces/bag 13-in. reel, 10000 pieces/reel 7-in. reel, 3000 pieces/reel Bulk, 500 pieces/bag 13-in. reel, 10000 pieces/reel 7-in. reel, 3000 pieces/reel Bulk, 500 pieces/bag 13-in. reel, 10000 pieces/reel 7-in. reel, 3000 pieces/reel Bulk, 500 pieces/bag 13-in. reel, 10000 pieces/reel Bulk, 500 pieces/bag 13-in. reel, 10000 pieces/reel Bulk, 500 pieces/bag
Mounting 3-pin SOT23W surface mount 3-pin SOT23W surface mount 3-pin SIP through hole 3-pin SOT23W surface mount 3-pin SOT23W surface mount 3-pin SIP through hole 3-pin SOT23W surface mount 3-pin SOT23W surface mount 3-pin SIP through hole 3-pin SOT23W surface mount 3-pin SOT23W surface mount 3-pin SIP through hole 3-pin SOT23W surface mount 3-pin SIP through hole 3-pin SOT23W surface mount 3-pin SIP through hole
Ambient, TA
Switchpoints (Typ.) BOP BRP
Output In South (Positive) Magnetic Field
-40C to 85C 35 -40C to 150C On (logic low) -40C to 85C 95 -40C to 150C 70 25
-40C to 85C 35 -40C to 150C 25 Off (logic high)
for additional packing options. 2Available through authorized Allegro distributors only.
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
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A1120, A1121 and A1125
Chopper Stabilized Precision Hall Effect Switches
Absolute Maximum Ratings
Characteristic Forward Supply Voltage Reverse Supply Voltage Output Off Voltage Continuous Output Current Reverse Output Current Operating Ambient Temperature Maximum Junction Temperature Storage Temperature Symbol VCC VRCC VOUT IOUT IROUT TA TJ(max) Tstg Range E Range L Notes Rating 26.5 -30 26 25 -50 -40 to 85 -40 to 150 165 -65 to 170 Units V V V mA mA C C C C
Pin-out Diagrams
GND 3
Package LH
Package UA
1 VCC
2 VOUT
1 VCC
2 GND
3 VOUT
Terminal List Name VCC VOUT GND Description Connects power supply to chip Output from circuit Ground Number Package LH Package UA 1 1 2 3 3 2
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
3
A1120, A1121 and A1125
Chopper Stabilized Precision Hall Effect Switches
ELECTRICAL CHARACTERISTICS Valid valid over full operating voltage and ambient temperature ranges; unless otherwise noted
Characteristics
Electrical Characteristics Forward Supply Voltage Output Leakage Current VCC IOUTOFF Operating, TJ < 165C A1120, A1121 A1125 Output Saturation Voltage VOUT(SAT) A1120, A1121 A1125 Output Current Limit IOM tPO fC tr tf ICC(ON) Supply Current ICC(OFF) Reverse Supply Current Supply Zener Clamp Voltage Zener Impedance Magnetic Characteristics Operate Point BOP A1120, A1125 A1121 Release Point BRP A1120, A1125 A1121 Hysteresis
1Typical 21
Symbol
Test Conditions
Min.
3 - - - - 30 30 - -
Typ.1
- - - 185 185 - - - 800 0.2 0.1 - - - - - - 50
Max.
24 10 10 500 500 60 60 25 - 2 2 4 4 4 4 -5 - -
Unit2
V A A mV mV mA mA s kHz s s mA mA mA mA mA V
VOUT = 24 V, B < BRP VOUT = 24 V, B > BOP IOUT = 20 mA, B > BOP IOUT = 20 mA, B < BRP B > BOP B < BRP
A1120, A1121 A1125
Power-On Time3 Chopping Frequency Output Rise Time3,4 Output Fall Time3,4
VCC > 3.0 V, B < BRP(min) - 10 G, B > BOP(max) + 10 G RL = 820 , CS = 20 pF RL = 820 , CS = 20 pF A1120, A1121 A1125 A1120, A1121 A1125 VCC = 12 V, B > BOP VCC = 12 V, B < BRP VCC = 12 V, B < BRP VCC = 12 V, B > BOP
- - - - - - - 28 -
IRCC VZ IZ
VRCC = -30 V ICC = 5 mA; TA = 25C ICC = 5 mA; TA = 25C
- 50 5 40 (BOP - BRP) - 10
35 95 25 70 10 25
50 135 - 110 - 42
G G G G G G
BHYS
A1120, A1125 A1121
data are are at TA = 25C and VCC = 12 V, and are for initial design estimations only. G (gauss) = 0.1 mT (millitesla). 3Guaranteed by device design and characterization. 4C = oscilloscope probe capacitance. S
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
4
A1120, A1121 and A1125
Chopper Stabilized Precision Hall Effect Switches
THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information
Characteristic Symbol Test Conditions Package LH, 1-layer PCB with copper limited to solder pads Package Thermal Resistance RJA Package LH, 2-layer PCB with 0.463 in.2 of copper area each side connected by thermal vias Package UA, 1-layer PCB with copper limited to solder pads Value Units 228 110 165 C/W C/W C/W
25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 20 40
Power Derating Curve TJ(max) = 165C; ICC = ICC(max)
VCC(max)
Maximum Allowable VCC (V)
Package LH, 2-layer PCB (R JA = 110 C/W) Package UA, 1-layer PCB (R JA = 165 C/W) Package LH, 1-layer PCB (R JA = 228 C/W) VCC(min)
60 80 100 120 140 160 180
Power Dissipation versus Ambient Temperature
1900 1800 1700 1600 1500 1400 1300 1200 1100 1000 900 800 700 600 500 400 300 200 100 0 20
Power Dissipation, PD (mW)
Pa (R cka ge JA = 1 LH 10 , 2Pac C lay /W er (R kage PC ) UA JA = B , 1165 C/ layer W) PC B
Pac k (R age LH ,1 JA = 2 28 -layer PCB C/W )
40
60
80 100 120 Temperature (C)
140
160
180
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
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A1120, A1121 and A1125
Chopper Stabilized Precision Hall Effect Switches
Characteristic Performance
A1120, A1121, and A1125 Electrical Characteristics
Average Supply Current (On) versus Ambient Temperature
6.0 5.5 5.0 4.5
Average Supply Current (On) versus Average Supply Voltage
6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 2 6 10 14 18 22 26
ICC(av) (mA)
4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 - 60 - 40 - 20 0 20 40 60 80 100 120 140 160
VCC (V)
3.0 12 24
ICC(av) (mA)
TA (C)
-40 25 150
TA (C)
VCC (V)
Average Supply Current (Off) versus Ambient Temperature
6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 - 60 - 40 - 20 0 20 40 60 80 100 120 140 160
Average Supply Current (Off) versus Average Supply Voltage
6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 2 6 10 14 18 22 26
ICC(av) (mA)
ICC(av) (mA)
VCC (V)
3.0 12 24
TA (C)
-40 25 150
TA (C)
VCC (V)
Average Output Saturation Voltage versus Ambient Temperature
300 250 200 150 100 50 0 - 60 - 40 - 20 0 20 40 60 80 100 120 140 160
Average Output Saturation Voltage versus Supply Voltage
300 250 200 150 100 50 0 2 6 10 14 18 22 26
VOUT(sat) (V)
VCC (V)
3.0 3.8 4.2 12 24
VOUT(sat) (V)
TA (C)
-40 25 150
TA (C)
VCC (V)
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
6
A1120, A1121 and A1125
Chopper Stabilized Precision Hall Effect Switches
A1120 and A1125 Magnetic Characteristics
Average Operate Point versus Ambient Temperature
50 45 40 35 30 25 20 15 10 5 0 -60 -40 -20 0 20 40 60 80 100 120 140 160 50 45 40 35
Average Operate Point versus Average Supply Voltage
BOP (G)
BOP (G)
VCC (V)
3.0 24
30 25 20 15 10 5 0 2 6 10 14 18 22 26
TA (C)
-40 25 150
TA (C)
VCC (V)
Average Release Point versus Ambient Temperature
50 45 40 35 50 45 40 35
Average Release Point versus Average Supply Voltage
BRP (G)
BRP (G)
30 25 20 15 10 5 0 -60 -40 -20 0 20 40 60 80 100 120 140 160
VCC (V)
3.0 24
30 25 20 15 10 5 0 2 6 10 14 18 22 26
TA (C)
-40 25 150
TA (C)
VCC (V)
Average Switchpoint Hysteresis versus Ambient Temperature
20 18 16 14 20 18 16 14 12 10 8 6 4 2 0 -60 -40 -20 0 20 40 60 80 100 120 140 160
Average Switchpoint Hysteresis versus Supply Voltage
BHYS (G)
12 10 8 6 4 2 0
VCC (V)
3.0 24
BHYS (G)
TA (C)
-40 25 150
2
6
10
14
18
22
26
TA (C)
VCC (V)
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
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A1120, A1121 and A1125
Chopper Stabilized Precision Hall Effect Switches
A1121 Magnetic Characteristics
Operate Point versus Ambient Temperature
140 130 120 110 140 130 120
Operate Point versus Average Supply Voltage
BOP (G)
100 90 80 70 60 50 - 60 - 40 - 20 0 20 40 60 80 100 120 140 160
BOP (G)
VCC (V)
3.0 12 24
110 100 90 80 70 60 50 2 6 10 14 18 22 26
TA (C)
-40 25 150
TA (C)
VCC (V)
Release Point versus Ambient Temperature
110 100 90 110 100 90
Release Point versus Average Supply Voltage
BRP (G)
BRP (G)
80 70 60 50 40
VCC (V)
3.0 12 24
80 70 60 50 40
TA (C)
-40 25 150
- 60 - 40 - 20
0
20
40
60
80
100 120 140 160
2
6
10
14
18
22
TA (C)
VCC (V)
Switchpoint Hysteresis versus Ambient Temperature
40 35 40 35
Switchpoint Hysteresis versus Supply Voltage
BHYS (G)
VCC (V)
3.0 12 24
BHYS (G)
30 25 20 15 10 - 60 - 40 - 20
30 25 20 15 10 2 6 10 14 18 22 26
TA (C)
-40 25 150
0
20
40
60
80
100 120 140 160
TA (C)
VCC (V)
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
8
A1120, A1121 and A1125
Chopper Stabilized Precision Hall Effect Switches
Functional Description
Operation The output of the A1120 and A1121 devices switches low (turns on) when a magnetic field perpendicular to the Hall element exceeds the operate point threshold, BOP (see panel A of figure 1). When the magnetic field is reduced below the release point, BRP , the device output goes high (turns off). The output of the A1125 devices switches high (turns off) when a magnetic field perpendicular to the Hall element exceeds the operate point threshold, BOP (see panel B of figure 1). When the magnetic field is reduced below the release point, BRP , the device output goes low (turns on). After turn-on, the output voltage is VOUT(SAT) . The output transistor is capable of sinking current up to the short circuit current limit, IOM, which is a minimum of 30 mA. The difference in the magnetic operate and release points is the hysteresis, BHYS , of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical vibration and electrical noise. Powering-on the device in the hysteresis range (less than BOP and higher than BRP) will give an indeterminate output state. The correct state is attained after the first excursion beyond BOP or BRP . Applications It is strongly recommended that an external bypass capacitor be connected (in close proximity to the Hall element) between the supply and ground of the device to reduce external noise in the application. As is shown in panel B of figure 1, a 0.1 F capacitor is typical. Extensive applications information for Hall effect devicers is available in: * Hall-Effect IC Applications Guide, Application Note 27701 * Guidelines for Designing Subassemblies Using Hall-Effect Devices, Application Note 27703.1 * Soldering Methods for Allegro's Products - SMT and ThroughHole, Application Note 26009 All are provided in Allegro Electronic Data Book, AMS-702, and the Allegro Web site, www.allegromicro.com.
V+ Switch to High Switch to Low
VCC
V+ Switch to High Switch to Low
VS
VCC
VCC
VOUT
VOUT
RL
VOUT
A112x
CBYP 0.1 F
Output
VOUT(SAT) 0 BRP BRP 0 B+ 0 0 BOP BHYS BOP BHYS
VOUT(SAT) B+
GND
(A)
(B)
(C)
Figure 1. Device switching behavior. In panels A and B, on the horizontal axis, the B+ direction indicates increasing south polarity magnetic field strength. This behavior can be exhibited when using an electrical circuit such as that shown in panel C.
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
9
A1120, A1121 and A1125
Chopper Stabilized Precision Hall Effect Switches
Chopper Stabilization Technique When using Hall effect technology, a limiting factor for switchpoint accuracy is the small signal voltage developed across the Hall element. This voltage is disproportionally small relative to the offset that can be produced at the output of the Hall element. This makes it difficult to process the signal while maintaining an accurate, reliable output over the specified operating temperature and voltage ranges. Chopper stabilization is a unique approach used to minimize Hall offset on the chip. The patented Allegro technique, namely Dynamic Quadrature Offset Cancellation, removes key sources of the output drift induced by thermal and mechanical stresses. This offset reduction technique is based on a signal modulationdemodulation process. The undesired offset signal is separated from the magnetic field-induced signal in the frequency domain, through modulation. The subsequent demodulation acts as a modulation process for the offset, causing the magnetic field induced signal to recover its original spectrum at baseband, while the dc offset becomes a high-frequency signal. The magnetic sourced signal then can pass through a low-pass filter, while the modulated DC offset is suppressed. This configuration is illustrated in figure 2.
The chopper stabilization technique uses a 400 kHz high frequency clock. For demodulation process, a sample and hold technique is used, where the sampling is performed at twice the chopper frequency (800 kHz). This high-frequency operation allows a greater sampling rate, which results in higher accuracy and faster signal-processing capability. This approach desensitizes the chip to the effects of thermal and mechanical stresses, and produces devices that have extremely stable quiescent Hall output voltages and precise recoverability after temperature cycling. This technique is made possible through the use of a BiCMOS process, which allows the use of low-offset, low-noise amplifiers in combination with high-density logic integration and sample-and-hold circuits. The repeatability of magnetic field-induced switching is affected slightly by a chopper technique. However, the Allegro high frequency chopping approach minimizes the affect of jitter and makes it imperceptible in most applications. Applications that are more likely to be sensitive to such degradation are those requiring precise sensing of alternating magnetic fields; for example, speed sensing of ring-magnet targets. For such applications, Allegro recommends its digital device families with lower sensitivity to jitter. For more information on those devices, contact your Allegro sales representative.
Regulator
Clock/Logic Hall Element Amp Low-Pass Filter
Figure 2. Model of chopper stabilization technique
Sample and Hold
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
10
A1120, A1121 and A1125
Chopper Stabilized Precision Hall Effect Switches
Power Derating The device must be operated below the maximum junction temperature of the device, TJ(max). Under certain combinations of peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors affecting operating TJ. (Thermal data is also available on the Allegro MicroSystems website.) The Package Thermal Resistance, RJA, is a figure of merit summarizing the ability of the application and the device to dissipate heat from the junction (die), through all paths to the ambient air. Its primary component is the Effective Thermal Conductivity, K, of the printed circuit board, including adjacent devices and traces. Radiation from the die through the device case, RJC, is relatively small component of RJA. Ambient air temperature, TA, and air motion are significant external factors, damped by overmolding. The effect of varying power levels (Power Dissipation, PD), can be estimated. The following formulas represent the fundamental relationships used to estimate TJ, at PD. PD = VIN x IIN T = PD x RJA TJ = TA + T (1) (2) (3)
A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding TJ(max), at a selected RJA and TA. Example: Reliability for VCC at TA = 150C, package LH, using a minimum-K PCB. Observe the worst-case ratings for the device, specifically: RJA = 228C/W, TJ(max) = 165C, VCC(max) = 24 V, and ICC(max) = 4 mA. Calculate the maximum allowable power level, PD(max). First, invert equation 3: Tmax = TJ(max) - TA = 165 C - 150 C = 15 C This provides the allowable increase to TJ resulting from internal power dissipation. Then, invert equation 2: PD(max) = Tmax / RJA = 15C / 228 C/W = 66 mW Finally, invert equation 1 with respect to voltage: VCC(est) = PD(max) / ICC(max) = 66 mW / 4 mA = 16.5 V The result indicates that, at TA, the application and device can dissipate adequate amounts of heat at voltages VCC(est). Compare VCC(est) to VCC(max). If VCC(est) VCC(max), then reliable operation between VCC(est) and VCC(max) requires enhanced RJA. If VCC(est) VCC(max), then operation between VCC(est) and VCC(max) is reliable under these conditions.
For example, given common conditions such as: TA= 25C, VCC = 12 V, ICC = 1.6 mA, and RJA = 165 C/W, then: PD = VCC x ICC = 12 V x 1.6 mA = 19 mW T = PD x RJA = 19 mW x 165 C/W = 3C TJ = TA + T = 25C + 3C = 28C
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
11
A1120, A1121 and A1125
Chopper Stabilized Precision Hall Effect Switches
Package LH, 3-Pin (SOT-23W)
+0.12 2.98 -0.08 1.49 D 3
A
+4 4 -0 +0.020 0.180-0.053
0.96 D +0.10 2.90 -0.20
D
+0.19 1.91 -0.06 0.25 MIN 1.00 1 2 0.55 REF 0.25 BSC Seating Plane Gauge Plane 8X 10 REF Branded Face
2.40 0.70
0.95
B
PCB Layout Reference View
1.00 0.13
NNT
+0.10 0.05 -0.05 0.95 BSC 0.40 0.10
1
C
Standard Branding Reference View N = Last two digits of device part number T = Temperature code
For Reference Only; not for tooling use (reference dwg. 802840) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown
A B
Active Area Depth, 0.28 mm REF Reference land pattern layout All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances Branding scale and appearance at supplier discretion Hall element, not to scale
C D
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
12
A1120, A1121 and A1125
Chopper Stabilized Precision Hall Effect Switches
Package UA, 3-Pin SIP
+0.08 4.09 -0.05
45
E
B C 1.52 0.05 1.44 E Mold Ejector Pin Indent Branded Face 45 1 D Standard Branding Reference View 0.79 REF A = Supplier emblem N = Last two digits of device part number T = Temperature code 2.04
+0.08 3.02 -0.05
E
NNT
2.16 MAX
0.51 REF
1
2
3 For Reference Only; not for tooling use (reference DWG-9049) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown
15.75 0.51
+0.03 0.41 -0.06
A
Dambar removal protrusion (6X)
B Gate burr area C Active Area Depth, 0.50 mm REF D E Branding scale and appearance at supplier discretion Hall element, not to scale
+0.05 0.43 -0.07
1.27 NOM
Copyright (c)2009-2010, Allegro MicroSystems, Inc. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro's products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the failure of that life support device or system, or to affect the safety or effectiveness of that device or system. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website: www.allegromicro.com
Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com
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